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HMC5983
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC5983.
LAYOUT CONSIDERATIONS
Besides keeping all components that may contain ferrous materials (nickel, etc.) away from the sensor on both sides of
the PCB, it is also recommended that there is no conducting copper under/near the sensor in any of the PCB layers. See
recommended layout below.
I2C Layout Examples: Notice that the one trace under the sensor in the dual supply mode is not expected to carry active
current since it is for pin 4 pull-up to VDDIO. Power and ground planes are removed under the sensor to minimize
possible source of magnetic noise. For best results, use non-ferrous materials for all exposed copper coding.
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